Potting

features

Potting

 

Typical Product:AS-301421, AS-3027B, AS-380101

By filling a complete electronic assembly with a solid compound for preventing from shock or vibration, and for exclusion of moisture and corrosive agents, the sensitive electronic components can be protected completely.
Recommend product:AS-301421, AS-3027B, AS-380101
Those products are one-component epoxy adhesives whcih can provide good and strong bonding to plastic and metal.

 

 Product  AS-301421  AS-3027B  AS-380101
 Feature  Low Modulus  Low CTE  High Tg/Low CTE COB
 Viscosity  8,000mPa.s  70,000mPa.s  55,000mPa.s
 Curing Condition  150℃/10min  140℃/30min  150℃/120min
 Tg  50℃  120℃  145℃
 CTE  78 ppm  31 ppm  14 ppm
 Modulus  2.5GPa  -  12GPa
 Tensile Shear Modulus  >18MPa  >18MPa  10MPa
 

 

PRODUCTS APPLICATIONS FEATURES

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