アセック株式会社

ポッティングPotting

Typical product:AS-301421, AS-3027B, AS-380101

By filling a complete electronic assembly with a solid compound for preventing from shock or vibration, and for exclusion of moisture and corrosive agents, the sensitive electronic components can be protected completely.
Recommend product:AS-301421, AS-3027B, AS-380101
Those products are one-component epoxy adhesives whcih can provide good and strong bonding to plastic and metal.

Product AS-301421 AS-3027B AS-380101
Feature Low modulus Low CTE High Tg/Low CTE COB
Viscosity 8,000mPa.s 70,000mPa.s 55,000mPa.s
Curing condition 150℃/10min 140℃/30min 150℃/120min
Tg 50℃ 120℃ 145℃
CTE 78 ppm 31 ppm 14 ppm
Modulus 2.5GPa 12GPa
Tensile shear modulus >18MPa >18MPa 10MPa

If you have any questions or require development, please feel free to contact us

Reception time/9:00~17:00