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By applying underfill in CSP、WLP、the solder ball between package and substrate can be protected the damage such as vibration, bending or dropping impact, and improve the reliability via vibration, bending or dropping impact to improve the reliability.
| Product | AS-3905 | AS-3028 |
|---|---|---|
| Feature | High permeability | High Reliability |
| Viscosity | 300mPa・s | 6,000mPa・s |
| Curing Condition | 125℃ x 15min 150℃ x 10min | 120℃ x 15min 150℃ x 8min |
| Integrated Amount of Light | 1000mJ/cm2 | 1000mJ/cm2 |
| Tg | 120℃ | 120℃ |
| CTE | 76 / 202ppm | 36 / 156ppm |
| Modulus | 2.7 GPa | 4.3 GPa |
| Tensil Shear Strength | 10MPa | >12MPa |
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