This is an anisotropic paste for bonding to substrate electrodes such as FPC with excellent workability and high connecting stability
|AS-4100||・Due to metal bonding by solder melting, the connection resistance is lower than ACF, and alteration of temporal pressure bonding force is not much.
・Comparing with connector type, it can correspond to fine pitch to achieve low hieight.
|AS-4200||・By improving the shape of the conductive particles, high connection reliability is possible.|
|Filler type||Solder filler||Ni-coated resin filler|
|CTE||82 / 192 ppm||72 ppm|
|Modulus||2.6 GPa||2.5 GPa|
|Tensile shear strength （FR4）||24 MPa|
|Application example||Adhesion of camera module and FPC||Module ：PCB/FPC|
If you have any questions or require development, please feel free to contact us