アセック株式会社

conductivityconductivity

Typical product:AS-4100、AS-4200

This is an anisotropic paste for bonding to substrate electrodes such as FPC with excellent workability and high connecting stability

AS-4100 ・Due to metal bonding by solder melting, the connection resistance is lower than ACF, and alteration of temporal pressure bonding force is not much.
・Comparing with connector type, it can correspond to fine pitch to achieve low hieight.
AS-4200 ・By improving the shape of the conductive particles, high connection reliability is possible.
Product AS-4100<※1> AS-4200
Filler type Solder filler Ni-coated resin filler
Viscosity 71,000mPa・s 54,000mPa・s
Pre-gel condition 130℃×10sec 130℃×10sec
Cure condition 180℃×15秒 180℃×15秒
Tg 126℃ 126℃
CTE 82 / 192 ppm 72 ppm
Modulus 2.6 GPa 2.5 GPa
Tensile shear strength (FR4)   24 MPa
Application example Adhesion of camera module and FPC Module :PCB/FPC
※1 The patent is authorized by Panasonic Factory Solutions.

If you have any questions or require development, please feel free to contact us

Reception time/9:00~17:00