Heat-curable adhesive is also called epoxy adhesive that activates and cures by applying the specified heat.
Strong chemical resistance and excellent adhesion are also the typical features.
Low-temp. cured type
Product No. |
Viscosity(mPa・s) |
Tg(℃) |
Curing condition |
Feature |
Application |
AS-3014 |
1100 |
38 |
80℃×15min |
Low-temp. fast curing |
Adhesion of diaphragm / magnet |
AS-301403 |
9500 |
32 |
80℃×15min |
Low-temp. fast curing |
Adhesion of micro speaker magnet |
AS-399618 |
1500 |
36 |
80℃×30min |
Light shielding |
Adhesion of plastic lens |
AS-301905 |
13000 |
95 |
90℃×60min |
Shock resistance、flow suppress |
Adhesion of linear vibrator coil |
AS-3030 |
3000 |
38 |
80℃×60min |
Shock and moisture resistance |
Adhesion of camera module holder |
High heat resistance type
Product No. |
Viscosity(mPa・s) |
Tg(℃) |
Curing condition |
Feature |
Application |
AS-300213 |
15000 |
104 |
100℃×30min |
Excellent PA adhesion |
Adhesion of camera module / frame |
AS-3607 |
18000 |
75 |
120℃×30min |
Flow suppress |
Board of sensor、cap |
AS-3711 |
15000 |
145 |
150℃×1min |
Fast curing |
Adhesion of heat resistance parts |
Underfill for secondary mounting
Product No. |
Viscosity(mPa・s) |
Tg(℃) |
CTE |
Curing condition |
Feature |
AS-3905 |
300 |
120 |
76 / 202 |
125℃×15min |
Low viscosity、High permeability |
AS-3028 |
4000 |
120 |
36 / 156 |
120℃×15min |
High reliability、Low CTE |
For sealing
Product No. |
Viscosity(mPa・s) |
Tg(℃) |
CTE |
Feature |
Application |
AS-300202 |
4500 |
104 |
- |
High adhesion |
Potting、sealing |
AS-3027B |
65000 |
120 |
31 / 140 |
Low shrinkage |
Sealing of connector pin |
AS-301421 |
8000 |
50 |
78 / 212 |
Heat resistance、high adhesion |
Sealing of connector pin |
AS-380101 |
55000 |
145 |
14 / 56 |
Low CTE |
Sealing of communication module IC. |
UV+ thermal curing
product |
Viscosity(mPa・s) |
Tg(℃) |
hardness |
features |
application example |
AS-340102 |
10000 |
86 |
D-75 |
High viscosity
UV fast curing |
holder adhesion of camera module |
Anisotropic conductive paste
product |
Filler type |
Viscosity(mPa・s) |
Pre-gelation condition |
curing condition |
Application example |
AS-4100 |
Solder particle |
71000 |
130℃×10sec |
180℃×15sec |
Adhesion of camera module & FPC |
AS-4200 |
Ni-coated resin |
54000 |
130℃×15sec |
180℃×15sec |
Various module、adhesion of PCB・FPC |
For impregnation
product |
Viscosity(mPa・s) |
Curing condition |
Features |
Remarks |
Application example |
AS-6701 |
45 |
120℃×30min |
Heat-curing acrylic、impact resistance |
ー |
Motor core laminated adhesion |
AS-6704 |
100 |
120℃×30min |
Heat-curing acrylic、Heat resistance |
ー |
Motor core laminated adhesion |