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Heat curable type

Heat-curable adhesive is also called epoxy adhesive that activates and cures by applying the specified heat.
Strong chemical resistance and excellent adhesion are also the typical features.

Low-temp. cured type

Product No. Viscosity(mPa･s) Tg(℃) Curing condition Feature Application
AS-3014 1100 38 80℃×15min Low-temp. fast curing Adhesion of diaphragm / magnet
AS-301403 9500 32 80℃×15min Low-temp. fast curing Adhesion of micro speaker magnet
AS-301418 1500 36 80℃×30min Light shielding Adhesion of plastic lens
AS-301705 13000 95 90℃×60min Shock resistance、flow suppress Adhesion of linear vibrator coil
AS-3030 3000 38 80℃×60min Shock and moisture resistance Adhesion of camera module holder

High heat resistance type

Product No. Viscosity(mPa･s) Tg(℃) Curing condition Feature Application
AS-300213 15000 104 100℃×30min Excellent PA adhesion Adhesion of camera module / frame
AS-3607 18000 75 120℃×30min Flow suppress Board of sensor、cap
AS-3711 15000 145 150℃×1min Fast curing Adhesion of heat resistance parts

Underfill for secondary mounting

Product No. Viscosity(mPa･s) Tg(℃) CTE Curing condition Feature
AS-3905 300 120 76 / 202 125℃×15min Low viscosity、High permeability
AS-3028 4000 120 36 / 156 120℃×15min High reliability、Low CTE

For sealing

Product No. Viscosity(mPa･s) Tg(℃) CTE Feature Application
AS-300202 4500 104 - High adhesion Potting、sealing
AS-3027B 65000 120 31 / 140 Low shrinkage Sealing of connector pin
AS-301421 8000 50 78 / 212 Heat resistance、high adhesion Sealing of connector pin
AS-380101 55000 145 14 / 56 Low CTE Sealing of communication module IC.

UV+ thermal curing

product Viscosity(mPa･s) Tg(℃) hardness features application example
AS-340102 10000 86 D-75 High viscosity
UV fast curing		 holder adhesion of camera module

Anisotropic conductive paste

product Filler type Viscosity(mPa･s） Pre-gelation condition curing condition Application example
AS-4100 Solder particle 71000 130℃×10sec 180℃×15sec Adhesion of camera module & FPC
AS-4200 Ni-coated resin 54000 130℃×15sec 180℃×15sec Various module、adhesion of PCB・FPC

For impregnation

product Viscosity(mPa･s) Curing condition Features Remarks Application example
AS-6701 45 120℃×30min Heat-curing acrylic、impact resistance ー Motor core laminated adhesion
AS-6704 100 120℃×30min Heat-curing acrylic、Heat resistance ー Motor core laminated adhesion

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